Wafer Bonding Machines
Room Temperature Wafer Bonding Machine
Mitsubishi Room Temperature Wafer Bonding Machine is utilised to bond 4-8 inch wafers by surface activation method.
- MEMS(Micro Electric Mechanical Systems) Wafer Level Packaging.
- 3D wafers stacking.
- R/D for new device such as LED, RF device, Quartz device etc.
Features
No thermal stress nor distortion caused.
- Highest device quality.
- Help to shrink/downsize the device.
Highest Throughput
- No Heating Cooling cycle.
Applicable to various materials.
- Si family, Metal, Compound semiconductor, Optical, Mono-crystals of oxides.